This paper is published in Volume-4, Issue-2, 2018
Area
Materials Joining and Statistical Analysis
Author
Venugopal S, Mahendran G
Org/Univ
Sathyabama Institute of Science and Technology, Chennai, Tamil Nadu, India
Keywords
AA5083 aluminium alloy, Diffusion bonding, L9 Orthogonal array, Desirability Approach.
Citations
IEEE
Venugopal S, Mahendran G. Optimization of the diffusion bonding parameters on aa5083 aluminium alloy using Taguchi’s technique, International Journal of Advance Research, Ideas and Innovations in Technology, www.IJARIIT.com.
APA
Venugopal S, Mahendran G (2018). Optimization of the diffusion bonding parameters on aa5083 aluminium alloy using Taguchi’s technique. International Journal of Advance Research, Ideas and Innovations in Technology, 4(2) www.IJARIIT.com.
MLA
Venugopal S, Mahendran G. "Optimization of the diffusion bonding parameters on aa5083 aluminium alloy using Taguchi’s technique." International Journal of Advance Research, Ideas and Innovations in Technology 4.2 (2018). www.IJARIIT.com.
Venugopal S, Mahendran G. Optimization of the diffusion bonding parameters on aa5083 aluminium alloy using Taguchi’s technique, International Journal of Advance Research, Ideas and Innovations in Technology, www.IJARIIT.com.
APA
Venugopal S, Mahendran G (2018). Optimization of the diffusion bonding parameters on aa5083 aluminium alloy using Taguchi’s technique. International Journal of Advance Research, Ideas and Innovations in Technology, 4(2) www.IJARIIT.com.
MLA
Venugopal S, Mahendran G. "Optimization of the diffusion bonding parameters on aa5083 aluminium alloy using Taguchi’s technique." International Journal of Advance Research, Ideas and Innovations in Technology 4.2 (2018). www.IJARIIT.com.
Abstract
Effect of bonding parameters on the bonding strength of AA5083 aluminum alloys was investigated in the present study. Rolled plates of 5 mm thick AA5083 aluminum alloys were fabricated by diffusion bonding. Bonding temperature, bonding pressure and holding time were considered as the varying process parameters. Experiments are designed as per the Taguchi technique for the experimentation sequence according to the L9 orthogonal array. The desirability approach is used as an optimization technique to obtain the maximum bonding strength and bonding strength of the joint. After running through 10 cycles of optimization, the most optimal parameters are the bonding temperature of 510 °C, bonding pressure 13 MPa and holding time of 45 min with the desirability of 0.82.
