This paper is published in Volume-7, Issue-3, 2021
Area
Printed Electronics
Author
Abirami K., Gayathri S., Hebziba Rani A.
Org/Univ
Avinashilingam Institute for Home Science and Higher Education for Women, Coimbatore, Tamil Nadu, India
Keywords
Package Printing, Circuit Printing, Smart Package, Printed Electronics
Citations
IEEE
Abirami K., Gayathri S., Hebziba Rani A.. Smart medical package, International Journal of Advance Research, Ideas and Innovations in Technology, www.IJARIIT.com.
APA
Abirami K., Gayathri S., Hebziba Rani A. (2021). Smart medical package. International Journal of Advance Research, Ideas and Innovations in Technology, 7(3) www.IJARIIT.com.
MLA
Abirami K., Gayathri S., Hebziba Rani A.. "Smart medical package." International Journal of Advance Research, Ideas and Innovations in Technology 7.3 (2021). www.IJARIIT.com.
Abirami K., Gayathri S., Hebziba Rani A.. Smart medical package, International Journal of Advance Research, Ideas and Innovations in Technology, www.IJARIIT.com.
APA
Abirami K., Gayathri S., Hebziba Rani A. (2021). Smart medical package. International Journal of Advance Research, Ideas and Innovations in Technology, 7(3) www.IJARIIT.com.
MLA
Abirami K., Gayathri S., Hebziba Rani A.. "Smart medical package." International Journal of Advance Research, Ideas and Innovations in Technology 7.3 (2021). www.IJARIIT.com.
Abstract
The prime objective of this project is to create a smart package for medicines using the printed electronics technique which enables LED light to glow. Insulin’s that are used in houses might not be stored under proper storing temperature. So a temperature sensing circuit is printed in the insulin package with a LED light glowing for indicating the improper storing temperature. When the user handles this package, it provides information about the storage temperature of the medicine. Screen printing technology is employed for circuit printing and digital printing for package printing. Silver conductive ink is used for circuit printing and components pasting. SMD (Surface Mount Device) components are used in the circuit. A smart package is developed to deliver the information exactly, thus making packages smarter will enable the users to grab the information easily and can be used in an effective way.